The MasterAir G100M Heat column technology is a two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. The fluid is transferred by the copper powder filled inside the column creating an anti-gravity heat transfer. Super quick heat transfer is made possible with Heat Column at a massive 41.2, the equivalent of 7X the size of traditional heat pipes. The unification of heat pipes and base into one unit captures and efficiently transfers the heat from CPU like never before. Heat transfer The MasterAir G100M Heat column technology is a two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. The fluid is transferred by the copper powder filled inside the column creating an anti-gravity heat transfer. Larger diameter Super quick heat transfer is made possible with Heat Column at a massive 41.2, the equivalent of 7X the size of traditional heat pipes. The unification of heat pipes and base into one unit captures and efficiently transfers the heat from CPU like never before. Low profile The low profile G100M stands at 74.5mm, a great fit for slim PC cases, including mini-ITX cases. Even at these small dimensions, the heatsink has cooling capacity of 130W TDP. RGB LED illumination A wired RGB LED controller is included with theM100M to personalize the RGB lighting anytime you want (no software needed). Switch it up depending on your mood, the possibilities are not limitless. Top down air flow performance A high-performance fan cools not only the CPU, but all surrounding components inside the case for exceptional thermal results.