Fast soldering on conventional leaded and SMD components - no bridges or icicles - No cleaning - reduces costs and eliminates CFC usage - Wide operating window - Non corrosive - safer than RMA fluxes - High surface insulation resistance - without cleaning - No residues to interfere with ATE probes - without cleaning - Formulated for foam, spray or wave application
Fast soldering on conventional leaded and SMD components - no bridges or icicles - No cleaning - reduces costs and eliminates CFC usage - Wide operating window - Non corrosive - safer than RMA fluxes - High surface insulation resistance - without cleaning - No residues to interfere with ATE probes - without cleaning - Formulated for foam, spray or wave application
in 3 offers
Fast soldering on conventional leaded and SMD components - no bridges or icicles - No cleaning - reduces costs and eliminates CFC usage - Wide operating window - Non corrosive - safer than RMA fluxes - High surface insulation resistance - without cleaning - No residues to interfere with ATE probes - without cleaning - Formulated for foam, spray or wave application
Fast soldering on conventional leaded and SMD components - no bridges or icicles - No cleaning - reduces costs and eliminates CFC usage - Wide operating window - Non corrosive - safer than RMA fluxes - High surface insulation resistance - without cleaning - No residues to interfere with ATE probes - without cleaning - Formulated for foam, spray or wave application
Last updated at 04/10/2024 07:20:10
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Updated about 2 hours ago