Simple design to perfectly protect the cooling module High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures. The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
Simple design to perfectly protect the cooling module High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures. The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
in 2 offers
Simple design to perfectly protect the cooling module High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures. The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
Simple design to perfectly protect the cooling module High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures. The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
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Last updated at 15/11/2024 13:51:47
+ $34.48 delivery
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originally posted on neweggbusiness.com
originally posted on microcenter.com
originally posted on microcenter.com
| General | |
| Capacity | 16 GB: 2 x 8 GB |
| Upgrade Type | Generic |
| Width | 140 mm |
| Depth | 7 mm |
Updated 5 minutes ago
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| General | |
| Capacity | 16 GB: 2 x 8 GB |
| Upgrade Type | Generic |
| Width | 140 mm |
| Depth | 7 mm |
